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Electronics Applications

Electronics Applications

 With a drive for compact, high density, powerful electronics, fluid dispensing offers an automated solution that produces high yield without reduced quality or steep costs. Experienced our engineers are equipped to keep up-to-date with cutting-edge changes and test new methods of production and assembly. Common applications include:

Applications

  • Conformal coatings on PCBA
  • Masking on PCBA
  • Wire bonding
  • Die bonding
  • Flex circuit bonding
  • Solder paste dispensing
  • Dam and fill/glob top encapsulation
  • LED encapsulation
  • Surface mount adhesive (SMa) applications
  • Potting
  • Bonding camera lens

Material Used

  • Silicones
  • RTV
  • UV cure adhesives and sealants
  • Solder pastes
  • Cyanoacrylates
  • Acrylics
  • Epoxy single and two-part fluids
  • Polyurethanes
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